JPH0226239U - - Google Patents
Info
- Publication number
- JPH0226239U JPH0226239U JP1988104063U JP10406388U JPH0226239U JP H0226239 U JPH0226239 U JP H0226239U JP 1988104063 U JP1988104063 U JP 1988104063U JP 10406388 U JP10406388 U JP 10406388U JP H0226239 U JPH0226239 U JP H0226239U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic package
- bonder
- die bonder
- brazes
- heats
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000005219 brazing Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/83009—Pre-treatment of the layer connector or the bonding area
- H01L2224/83048—Thermal treatments, e.g. annealing, controlled pre-heating or pre-cooling
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988104063U JPH0226239U (en]) | 1988-08-08 | 1988-08-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988104063U JPH0226239U (en]) | 1988-08-08 | 1988-08-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0226239U true JPH0226239U (en]) | 1990-02-21 |
Family
ID=31335449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988104063U Pending JPH0226239U (en]) | 1988-08-08 | 1988-08-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0226239U (en]) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS562646A (en) * | 1979-06-22 | 1981-01-12 | Hitachi Ltd | Removal and reinstallation of silicon chip |
| JPS6049637A (ja) * | 1983-08-29 | 1985-03-18 | Nec Corp | 半導体基板のマウント方法 |
| JPS62296432A (ja) * | 1986-06-17 | 1987-12-23 | Toshiba Corp | 半導体装置の組立装置 |
-
1988
- 1988-08-08 JP JP1988104063U patent/JPH0226239U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS562646A (en) * | 1979-06-22 | 1981-01-12 | Hitachi Ltd | Removal and reinstallation of silicon chip |
| JPS6049637A (ja) * | 1983-08-29 | 1985-03-18 | Nec Corp | 半導体基板のマウント方法 |
| JPS62296432A (ja) * | 1986-06-17 | 1987-12-23 | Toshiba Corp | 半導体装置の組立装置 |